Heat-sealable multi-layer film structure same

Stock material or miscellaneous articles – Structurally defined web or sheet – Including components having same physical characteristic in...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

428331, 428451, 428516, 428910, 525240, 2641761, B32B 2708

Patent

active

049119761

ABSTRACT:
A multi-layer structure of low COF also having antistick characteristics over a wide temperature range during heat-sealing, comprising an amine containing polypropylene core layer having one or more skin layers of a low stereoregularity polyolefin containing, silica and a polysiloxane and a method of forming the same.

REFERENCES:
patent: 3508944 (1970-04-01), Henderson
patent: 4147827 (1979-04-01), Breidt, Jr. et al.
patent: 4348457 (1982-09-01), Rosenthal et al.
patent: 4419410 (1983-12-01), Weiner
patent: 4419411 (1983-12-01), Park
patent: 4439478 (1984-03-01), Fergurson et al.
patent: 4716068 (1987-12-01), Seifried et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Heat-sealable multi-layer film structure same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat-sealable multi-layer film structure same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat-sealable multi-layer film structure same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1650191

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.