Heat-sealable connector and method for the preparation thereof

Details Heat-sealable connector and method for the preparation thereof Heat-sealable connector and method for the preparation thereof

1994-11-18

1995-11-28

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427261, 427286, 427299, 427402, B05D 300, B05D 500

Patent

active

054706076

ABSTRACT:
Proposed is an improved heat-sealable connector having aligned lines of an electroconductive paste formed by screen printing on the surface of a flexible substrate. Different from conventional heat-sealable connectors, the electroconductive lines are not formed directly on the surface of the substrate but the substrate surface is first provided with a layer of a solvent-absorptive material and the electroconductive lines are formed on the solvent-absorptive layer by screen printing so that the screen-printed lines of the paste never cause running to broaden the line width by virtue of immediate absorption of the solvent in the paste into the solvent-absorptive layer to contribute not only to the productivity but also to the quality of the product connectors.

Affiliated with

Also associated with

Rating

Heat-sealable connector and method for the preparation thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat-sealable connector and method for the preparation thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat-sealable connector and method for the preparation thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2011880