Heat seal blister package having improved moisture vapor...

Details Heat seal blister package having improved moisture vapor... Heat seal blister package having improved moisture vapor...

2007-01-23

2007-01-23

Yu, Mickey (Department: 3728)

Special receptacle or package

Article housing attached to panel

C206S524300

Reexamination Certificate

active

10125909

ABSTRACT:
A heat seal blister package having an improved moisture vapor transmission barrier hindering penetration of moisture into the blister package from the surrounding environment to support and protect a product therewithin, and a method for forming same. The blister package includes a substantially paperboard substrate, a coating having moisture vapor transmission barrier properties and heat seal capabilities and a plastic blister attached to at least one side of the substrate over a coated portion of the substrate by a heat seal, to create an enclosed pocket isolated from the surrounding environment, in which to house a product. The coating imparts a moisture vapor transmission barrier to the paperboard substrate to reduce penetration of moisture through the substrate, while simultaneously imparting heat sealing capabilities to the coated portion of the substrate to make the coated portion of the substrate susceptible to a heat seal.

REFERENCES:
patent: 3449302 (1969-06-01), Nachbur et al.
patent: 3645824 (1972-02-01), Patton
patent: 3716511 (1973-02-01), Haskell
patent: 3784004 (1974-01-01), Meyer
patent: 3850726 (1974-11-01), Smith et al.
patent: 3872970 (1975-03-01), Edison
patent: 3946139 (1976-03-01), Bleyle et al.
patent: 4125190 (1978-11-01), Davie, Jr. et al.
patent: 4266666 (1981-05-01), Kuchenbecker
patent: 4270659 (1981-06-01), Kuchenbecker
patent: 4359158 (1982-11-01), Gringer
patent: 4574951 (1986-03-01), Weaver
patent: 4702368 (1987-10-01), Jones
patent: 4901858 (1990-02-01), Anderson
patent: 4925684 (1990-05-01), Simon
patent: 5150793 (1992-09-01), Tannenbaum
patent: 5172812 (1992-12-01), Wharton et al.
patent: 5244087 (1993-09-01), Hikake et al.
patent: 5244996 (1993-09-01), Kawasaki et al.
patent: 5353935 (1994-10-01), Yeager et al.
patent: 5356010 (1994-10-01), Weinstein
patent: 5360116 (1994-11-01), Schmiletzky
patent: 5377836 (1995-01-01), Eisenbraum
patent: 5414008 (1995-05-01), Muller et al.
patent: 5418008 (1995-05-01), Calvert
patent: 5486390 (1996-01-01), Burns et al.
patent: 5725917 (1998-03-01), Parks
patent: 5775516 (1998-07-01), McCumber et al.
patent: 5819939 (1998-10-01), Boyer
patent: 5888565 (1999-03-01), Gics
patent: 5935664 (1999-08-01), Claytor et al.
patent: 6010784 (2000-01-01), Peterson
patent: 6016914 (2000-01-01), Gustafson
patent: 6053320 (2000-04-01), Kuethe
patent: 6092664 (2000-07-01), Bartosek
patent: 6155423 (2000-12-01), Katzner et al.
patent: 6161699 (2000-12-01), Gartland
patent: 6273260 (2001-08-01), ColDepietro et al.
patent: 6365680 (2002-04-01), Edgington et al.
patent: 6401926 (2002-06-01), Lo
patent: 6409020 (2002-06-01), Lo
patent: 6523691 (2003-02-01), Raj et al.
patent: 6669236 (2003-12-01), Hollwarth-Oberholz

Affiliated with

Also associated with

Rating

Heat seal blister package having improved moisture vapor... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat seal blister package having improved moisture vapor..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat seal blister package having improved moisture vapor... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3736058