Heat-resistant vibration-damping pressure-sensitive adhesive com

Details Heat-resistant vibration-damping pressure-sensitive adhesive com Heat-resistant vibration-damping pressure-sensitive adhesive com

1992-11-09

1994-01-18

Schofer, Joseph L.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

5263184, 524100, 524290, B32B 710, C08F22006

Patent

active

052798968

ABSTRACT:
A vibration-damping pressure-sensitive adhesive composition containing a crosslinked structure of a copolymer comprising (A) from 75 to 92% by weight of a main monomer comprising an alkyl (meth)acrylate containing from 8 to 12 carbon atoms in the alkyl moiety thereof and (B) from 8 to 25% by weight of a carboxyl-containing monomer whose homopolymer has a glass transition temperature of 50.degree. C. or more, said crosslinked structure having a solvent-insoluble content of 80% by weight or more and a weight loss of 3% by weight or less on heating at 120.degree. C. for 240 hours, and said composition having a T-peel strength of 400 g/20 mm-width or more from a SUS plate and a loss factor of 0.05 or more at 60.degree. C. in the vicinity of 1 kHz as determined by a half-value width method. The composition exhibits satisfactory heat resistance against long-term use in high temperatures as well as satisfactory adhesion to various parts at room temperature.

REFERENCES:
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patent: 4418120 (1983-11-01), Kealy et al.
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patent: 4751269 (1988-06-01), Bonk et al.
patent: 4843134 (1989-06-01), Kotnour et al.
patent: 4861822 (1989-08-01), Keskey et al.
patent: 4925908 (1990-05-01), Bernard et al.
Japanese Industrial Standard JIS-G-4305 (1991).

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