Heat-resistant thermosetting resin composition

Details Heat-resistant thermosetting resin composition Heat-resistant thermosetting resin composition

1980-12-03

1982-01-05

Lieberman, Paul

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

428417, 428418, C08L 2904

Patent

active

043095127

ABSTRACT:
A thermosetting resin composition containing as essential resin components (a) a maleimide compound modified with furfuryl alcohol, (b) an epoxy resin and (c) a polyvinyl formal, and a latent curing agent or a curing accelerator which is at least one compound selected from the group consisting of dicyandiamide, boron trifluoride-amine complexes, metal chelate compounds, and silicone compounds and organo-silane compounds having at least one hydroxyl group bonded directly to silicon atom, is found to be capable of B-staging with good storage stability and provides a heat-resistant resin composition having excellent electric characteristics at high temperatures after curing. The composition can suitably be coated on a glass cloth or a mica tape to give a pre-preg tape which can maintain its flexibility for a long time.

REFERENCES:
patent: 2713567 (1955-07-01), Scheibli
patent: 3098054 (1963-07-01), Rosenberg
patent: 3172921 (1965-03-01), Flowers
patent: 4131707 (1978-12-01), Zahir
patent: 4248977 (1981-02-01), Wertz

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