Heat-resistant thermosetting polyimide resin with bis-phenol-epi

Details Heat-resistant thermosetting polyimide resin with bis-phenol-epi Heat-resistant thermosetting polyimide resin with bis-phenol-epi

1976-08-30

1978-06-27

Anderson, Harold D.

Chemistry of carbon compounds

Miscellaneous organic carbon compounds

C-metal

260 47EP, 260 47CZ, 260 47UA, 260 78UA, C08L 6302

Patent

active

040975452

ABSTRACT:
A heat-resistant thermosetting resin composition is obtained by reaction with each other of an N,N'-bis-imide of unsaturated dicarboxylic acid (A), a cyanuric or isocyanuric acid or derivatives thereof (B), and at least one compound (C) selected from the group consisting of tetracarboxylic acid diimide, hydantoin and derivatives thereof, and barbituric acid and derivatives thereof. This resin composition has excellent heat-resistance and workability, and is employed for the use of a molding, laminated sheet, adhesive, etc.

REFERENCES:
patent: 3770705 (1973-11-01), Akiyama et al.

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