Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2006-05-02
2008-12-09
Patel, Ishwar I. B. (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S262000
Reexamination Certificate
active
07462784
ABSTRACT:
This invention provides a multilayer printed wiring board which achieves fine pitches. A heat resistant substrate is incorporated in a multilayer printed wiring board and interlayer resin insulation layer and conductive layer are placed alternately on the heat resistant substrate. A built-up wiring board in which respective conductive layers are connected by via hole is formed. A via hole is formed on the surface of a mirror-processed Si substrate by using a heat resistant substrate composed of Si substrate so that finer wiring than a resin substrate having unevenness in its surface can be formed, whereby achieving fine pitches. Further, by forming the wiring on a mirror processed surface, dispersion of wiring decreases thereby decreasing dispersion of impedance.
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Computer translation of JP02004228521A.
Furutani Toshiki
Kariya Takashi
Kawanishi Takeshi
IBIDEN Co., Ltd.
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
Patel Ishwar (I. B).
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