Heat resistant substrate incorporated circuit wiring board

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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Details

C174S262000

Reexamination Certificate

active

07994432

ABSTRACT:
A circuit wiring board including a wiring substrate, and a heat resistant substrate accommodated in the wiring substrate and having a thermal expansion coefficient in a range between 3 ppm to 10 ppm and including a core substrate and a built-up wiring layer formed over the core substrate, the built-up wiring layer including conductive layers, interlayer resin insulating layers and a via hole conductor connecting the conductive layers through one of the interlayer resin insulating layers.

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Computer Translation of JP02004228521A.
U.S. Appl. No. 12/488,224, filed Jun. 19, 2009, Kariya, et al.

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