Heat-resistant resin paste and integrated circuit device produce

Details Heat-resistant resin paste and integrated circuit device produce Heat-resistant resin paste and integrated circuit device produce

1989-12-18

1992-02-11

Michl, Paul R.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

524 87, 524 89, 524 92, 524602, 524607, 524728, C08K 534, C08L 5100, C08J 309

Patent

active

050876589

ABSTRACT:
A heat-resistant resin paste consisting essentially of a first organic liquid (A.sub.1), a second organic liquid (A.sub.2), a heat-resistant resin (B) which is soluble in an organic liquid mixture consisting essentially of the first organic liquid (A.sub.1) and the second organic liquid (A.sub.2), and fine particles of a heat-resistant resin (C) which are soluble in the first organic liquid (A.sub.1), but insoluble in the second organic liquid (A.sub.2). The first organic liquid (A.sub.1), the second organic liquid (A.sub.2), and the heat-resistant resin (B) are brought into a solution in which the fine particles of a heat-resistant resin (C) are dispersed. The heat-resistant resin paste may be suitably used for screen process printing to provide integrated circuit devices with insulator layers or surface protecting layers. The heat-resistant resin paste is suitable for forming insulator layers or surface protecting layers in integrated circuit devices by employing screen process printing.

REFERENCES:
patent: 4495321 (1985-01-01), Arnold
patent: 4540734 (1985-09-01), Short et al.
patent: 4696764 (1987-09-01), Yamazaki
IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. Chmt, No. 4, Dec. 1986.
Patent Abstracts of Japan, vol. 9, No. 104, May 8, 1985, Production of Granular Polyamide Resin (Abstract only).

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