Heat resistant resin composition comprising modified polyamide-i

Details Heat resistant resin composition comprising modified polyamide-i Heat resistant resin composition comprising modified polyamide-i

1982-12-23

1984-05-29

Anderson, Harold D.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525419, 525420, 525436, 525452, C08G 7310

Patent

active

044516215

ABSTRACT:
A heat resistant resin composition comprising a, polyamide imide resin having carboxyl groups and modified with an N-methylolated methacryl- or acryl- amide compound and, when desired, further with a bismaleimide compound. The composition has improved properties over conventional polyamide imide resins. When the composition is used, for example, in the form of a film for printed circuit boards, the film has improved heat resistance and enhanced flexural strength and is capable of withstanding soldering baths at high temperatures.

REFERENCES:
patent: 3541038 (1970-11-01), Nakano et al.
patent: 3658773 (1972-04-01), Zecher et al.
patent: 3764501 (1973-10-01), Hori et al.
English Translation-Claim-Japanese Publication 19274/1969; 16080/1967; 34455/1974.
Chemical Abstracts-Naming and Indexing of Chemical Compounds, vol. 56, pp. 89, 94.

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