Heat resistant resin composition and adhesive film

Details Heat resistant resin composition and adhesive film Heat resistant resin composition and adhesive film

2006-06-13

2006-06-13

Robertson, Jeffrey B. (Department: 1712)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From heterocyclic reactant containing as ring atoms oxygen,...

C528S418000, C525S418000, C525S423000, C525S451000, C525S523000, C525S528000

Reexamination Certificate

active

07060786

ABSTRACT:
A resin composition comprising the associated product of a polyimide resin having phenolic hydroxyl groups in the skeleton with an epoxy resin-curing catalyst, an epoxy resin having at least two glycidyl groups, and an epoxy resin-curing agent has a high bond strength, a low modulus of elasticity and heat resistance. An adhesive film comprising the resin composition is useful as an adhesive or sealant for printed circuit boards and semiconductor packages.

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