Heat resistant positive resists containing polyoxazoles

Details Heat resistant positive resists containing polyoxazoles Heat resistant positive resists containing polyoxazoles

1980-07-18

1982-07-13

Brammer, Jack P.

Radiation imagery chemistry: process, composition, or product th

Diazo reproduction, process, composition, or product

Composition or product which contains radiation sensitive...

20415918, 430190, 430270, G03C 168

Patent

active

043395210

ABSTRACT:
The invention relates to heat-resistant positive resists based upon precursor stages of highly heat-resistant polymers and light-sensitive diazoquinones, as well as to a method for preparing heat-resistant relief structures of such positive resists. The positive resists of the type mentioned are developed in such a manner that they are heat-resistant as well as have a long storage life and are easily processed. The invention provides for the use of oligomer and/or polymer precursor stages of polyoxazoles in the form of polycondensation products of aromatic and/or heterocyclic dihydroxydiamino compounds and dicarboxylic acid chlorides or esters. The positive resists according to the invention are suitable especially for applications in microelectronics.

REFERENCES:
patent: 4093461 (1978-06-01), Loprest et al.

Affiliated with

Also associated with

Rating

Heat resistant positive resists containing polyoxazoles does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat resistant positive resists containing polyoxazoles, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat resistant positive resists containing polyoxazoles will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-204284