Heat-resistant polyimide insulative coated thermal head

Details Heat-resistant polyimide insulative coated thermal head Heat-resistant polyimide insulative coated thermal head

1988-01-29

1989-09-19

Goldberg, E. A.

Recorders

Thermal recording

219216, 4274071, 4284735, 428458, G01D 1510, B05D 136, B32B 2700

Patent

active

048685844

ABSTRACT:
A polyamic acid is synthesized by the ring-opening poly-addition reaction using a biphenyl tetracarboxylic acid as a tetracarboxylic acid moiety and an aromatic diamine, particularly p-phenylene diamine, as a diamine moiety. An aromatic polyimide resin layer possessing a highly desirable heat-resisting property as a heat-resistant insulating coating material and excelling in adhesive strength relative to a substrate is obtained by adjusting the polyamic acid in viscosity with a suitable organic solvent, applying the resultant polyamic acid on a substrate, and firing the applied layer of the polyamic acid. The substrate, for example, is a conductor layer formed as with copper and used as a multi-layer wiring board for hybrid IC's. In a thermal head which is obtained by forming an insulating layer on a metallic substrate and superposing a multiplicity of heat-generating resistors and conductors connected severally to the heat-generating resistors on insulating layer, the aforementioned aromatic polyimide resin layer is formed on the metallic substrate. This aromatic polyimide resin layer as an insulating layer in the thermal head withstands harsh working temperature conditions and adheres strongly to the metallic substrate. Thus, it manifests various outstanding effects.

REFERENCES:
patent: 3740305 (1973-06-01), Hoback et al.
patent: 4561789 (1985-12-01), Saito
patent: 4626872 (1986-12-01), Takeno
patent: 4680593 (1987-07-01), Takeno et al.
Takeno et al., "Vertical Compact Thermal Head Using Polyimide Substrate," 1986 National Conference Record of Institute of Electronics and Communication Engineers of Japan, 1-125, 1986.

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