Heat resistant polybenzoxazole from bis-((aminohydroxyphenyl)hex

Details Heat resistant polybenzoxazole from bis-((aminohydroxyphenyl)hex Heat resistant polybenzoxazole from bis-((aminohydroxyphenyl)hex

1989-03-23

1990-07-03

Anderson, Harold D.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

428 1, 525420, 528183, 528185, 528347, 528348, C08G 7322

Patent

active

049392158

ABSTRACT:
Heat resistant, shapable, hydroxy and/or alkoxy-substituted polyamides derived from at least one diamine selected from unsubstituted and substituted 4,4'-bis[2-(4-amino-3-hydroxyphenyl)hexafluoroisopropyl)]diphenyl ether 4,4'-bis-[2-(3-amino-4-hydroxyphenyl)hexafluoroisopropyl]diphenyl ether and a dicarboxylic acid or a derivative thereof e.g. its acid halo or ester. The polyamides of the invention may be thermally cured to form polybenzoxazoles of higher heat resistance which are stable to hydrolytic, chemical and radiation attack.
The polyamides of the invention may be formed into shaped articles by molding, extrusion and solvent casting processes preferably in the presence of a solvent or diluent and then optionally converted into heat resistant, insoluble polybenzoxazoles. These shaped articles are useful in aircraft, electronic and other commercial applications where heat, chemical and radiation resistance are desired in conjunction with good mechanical and electrical properties.

REFERENCES:
patent: 3449296 (1969-06-01), Angelo et al.
patent: 4477648 (1984-10-01), Jones et al.
patent: 4845183 (1989-07-01), Mueller et al.

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