Heat resistant polyamide film

Details Heat resistant polyamide film Heat resistant polyamide film

1991-09-06

1992-09-01

Tentoni, Leo B.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

2642358, B29C 5512, C08L 7700

Patent

active

051439832

ABSTRACT:
A heat resistant polyamide film which is obtained by melt-extruding into a sheet a polyamide composition of a mixture of a preformed polyamide (A) composed of diaminobutane and adipic acid and a semi-aromatic polyamide (B) composed of a polyamide containing an aromatic dicarboxylic acid and an aliphatic diamine in an amount of at least 80% by weight of the polyamide-constituting components, in a weight ratio of (A):(B)=99.9:0.1 to 30:70, quenching the sheet, then biaxially stretching it at least 2.0.times.2.0 times, followed by heat setting at a temperature of at least 205.degree. C., and which has a heat distortion initiation temperature of at least 130.degree. C.

REFERENCES:
patent: 4120928 (1978-10-01), Furukawa et al.
patent: 4849498 (1989-07-01), Roerdink et al.

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