Heat-resistant plastic semiconductor device

Details Heat-resistant plastic semiconductor device Heat-resistant plastic semiconductor device

1987-03-11

1988-10-11

Kucia, R. R.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

174 52FP, 174 52PE, 357 70, H01L 2156

Patent

active

047775203

ABSTRACT:
A heat-resistant plastic-packaged semiconductor device comprises an IC chip having contacts on its first surface, an island on which the IC chip is mounted with its second surface facing a first surface of the island, a low-adhesion layer which is formed on a second surface of the island, external leads, bonding wires for connection of the contacts on the IC chip and inner ends of the external leads, a package of mold resin for encapsulating the IC chip, the low-adhesion layer, the bonding wires and inner parts of the external leads, the mold resin being provided with a vent hole which extends to the vicinity of the low-adhesion layer. The low-adhesion layer has a low or no adhesive power to the mold resin.

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