Heat-resistant molding resin composition

Details Heat-resistant molding resin composition Heat-resistant molding resin composition

1975-12-29

1979-01-02

DeBenedictis, Sr., Thomas

Chemistry of carbon compounds

Miscellaneous organic carbon compounds

C-metal

260 40R, 260 4218, 260857UN, 260862, 260870, 260873, 260876R, C08L 7706

Patent

active

041327470

ABSTRACT:
A novel heat-resistant resin composition moldable in 20 to 180 seconds at a temperature of 130.degree. to 180.degree. C. and excellent in mechanical strengths at high temperatures is obtained by mixing a polyaminobismaleimide with a modifying reagent selected from the group consisting of (A) a diallyl phthalate prepolymer and (B) a mixture thereof with at least one monomer having a polymerizable double bond and 2 to 20 carbon atoms, and an organic peroxide. In this resin composition, the low mechanical strengths at high temperatures of phenolic resins and silicone resins, which are a drawback of these resins, and the unsatisfactory curability of an unmodified polyaminobismaleimide resin have been overcome. The present composition, therefore, is suitable for use in electrical parts, electronic parts, automobile parts, and machine parts.

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patent: 3998787 (1976-12-01), Bargain
patent: 4035345 (1977-07-01), Ducloux et al.
patent: 4039628 (1977-08-01), Bargain
patent: 4064193 (1977-12-01), Bargain

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