Heat resistant material for molds and other articles

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C264S125000, C264S126000, C264S219000, C264S319000, C264S327000, C264S331110, C427S374400, C427S376200, C428S364000, C428S402000, C428S447000

Reexamination Certificate

active

07098275

ABSTRACT:
A mixture of particulate silicone based material and small hollow elements, such as spheres and/or fibers, is provided. The particulate silicone based material is heated to a temperature between about 200° F. and about 400° F. The particulate silicone based material is cooled until a solid body is formed. The solid body is resistant to melting and thermal decomposition when heated to temperatures of at least 3000° F. The solid body may contain cavities formed by the small hollow elements. The solid body may contain reinforcing fibers. The solid body may contain both small hollow elements and fibers.

REFERENCES:
patent: 3172176 (1965-03-01), Greenwood
patent: 3628985 (1971-12-01), Hider et al.
patent: 4769197 (1988-09-01), Kromrey
patent: 4795600 (1989-01-01), Kromrey
patent: 4962162 (1990-10-01), Kosuda et al.
patent: 5167876 (1992-12-01), Lem et al.
patent: 5219498 (1993-06-01), Keller et al.
patent: 5342650 (1994-08-01), Daly, III
patent: 5523374 (1996-06-01), Bard et al.
patent: 5552466 (1996-09-01), Beckley et al.
patent: 5612399 (1997-03-01), Beckley et al.
patent: 5623030 (1997-04-01), Tsumura et al.
patent: 5632925 (1997-05-01), Moulton et al.
patent: 5747608 (1998-05-01), Katsoulis et al.
patent: 5884688 (1999-03-01), Hinton et al.
patent: 6183873 (2001-02-01), Clarke
patent: 6265333 (2001-07-01), Dzenis et al.
patent: 2004/0241443 (2004-12-01), Decker et al.
Publication by General Electric Company entitled “GE Silicones” and “Material Safety Data Sheet Silicone Molding Compound”, publication date unknown, but date printed is Mar. 28, 2000.
Publication by GE Silicones entitled “MC550BK1”, publication date unknown, but prior to Jun. 5, 2001.
Publication by GE Toshiba Silicones Co., Ltd. entitled “TRIPLUS-Solventless Silicone Resin Blend System”, publication date unknown, last copyright date 2000.
Publication by GE Silicones entitled “Technical Library-TRIPLUS-Solventless Silicone Resin Blend System”, publication date unknown but copyright date 2001.
Publication GE Silicones and TRIPLUS 179, publication date unknown but prior to Apr. 20, 2001.
GE Silicones publication for product TPR178, entitled “Material Safety Data Sheet Polyalkylsiloxanes”, publication date unknown, printed Mar. 28, 2000.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Heat resistant material for molds and other articles does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat resistant material for molds and other articles, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat resistant material for molds and other articles will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3643933

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.