Heat-resistant insulating substrate, thermal printing head, and

Details Heat-resistant insulating substrate, thermal printing head, and Heat-resistant insulating substrate, thermal printing head, and

1991-12-09

1993-01-05

Fuller, Benjamin R.

Recorders

Thermal recording

B41J 2335

Patent

active

051774984

ABSTRACT:
A layer of an amorphous substance containing at least one member from among hydrogen and halogen elements and using as main components thereof silicon and at least one member selected from among nitrogen, carbon, and oxygen is formed as a resin-protecting layer or an abrasion-resistant layer in a thermal printing head or as a resin-protecting layer in a heat-resistant insulating substrate. The hardness of the substrate itself is greatly improved by this layer of the amorphous substance. As the result, the substrate as a whole or the thermal printing head as a whole acquires high rigidity and improved resistance to crack.

REFERENCES:
patent: 4868584 (1989-09-01), Nikaido et al.
English translation of claim 1 of each of Japanese patent application Nos. 62-21428, 62-134326, and 62-62-191655 Copending application Ser. No. 07/400,086 filed Aug. 29, 1989.
Adams et al., "Characterization of Plasma-Deposited Silicon Dioxide", Journal of the Electrochemical Society, vol. 128, No. 7, Jul. 1981, pp. 1545-1551.

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