Heat-resistant insulating substrate, thermal printing head, and

Details Heat-resistant insulating substrate, thermal printing head, and Heat-resistant insulating substrate, thermal printing head, and

1990-05-04

1992-06-02

Fuller, Benjamin R.

Recorders

Thermal recording

B41J 2335

Patent

active

051191121

ABSTRACT:
A layer of an amorphous substance containing at least one member from among hydrogen and halogen elements and using as main components thereof silicon and at least one member selected from among nitrogen, carbon and oxygen is formed as a resin-protecting layer or an abrasion-resistant layer in a thermal printing head or as a resin-protecting layer in a heat-resistant insulating substrate. The hardness of the substrate itself is greatly improved by this layer of the amorphous substance. As the result, the substrate as a whole or the thermal printing head as a whole acquires high rigidity and improved resistance to crack.

REFERENCES:
patent: 4750260 (1988-06-01), Takeno et al.
patent: 4777103 (1988-10-01), No et al.
patent: 4835548 (1989-05-01), Nikaido et al.
patent: 4868584 (1989-09-01), Nikaido et al.

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