Heat-resistant hermetic packages for electronic components

Details Heat-resistant hermetic packages for electronic components Heat-resistant hermetic packages for electronic components

1991-08-21

1993-09-21

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257690, H01L 2302

Patent

active

052471349

ABSTRACT:
A heat-resistant package for electrical components comprises a housing composed of a plurality of independent side walls made of heat resistant ceramic material. Sealed-in leads are provided in one or more of the side walls. After, the leads are installed the ends of the side walls are brazed together to form a closed ring and that ring is brazed to the housing bottom wall. Also, a continuous metal ring may be brazed to the tops of the side walls. The brazings provide hermetic seals between the housing walls and they, along with the seal ring, provide compliance between the walls making the housing resistant to thermal shocks.

REFERENCES:
patent: 4504887 (1985-03-01), Bakermans et al.
patent: 4506108 (1985-03-01), Kersch et al.
patent: 4547624 (1985-10-01), Tower et al.

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