Heat-resistant flexible laminate for substrate of printed circui

Details Heat-resistant flexible laminate for substrate of printed circui Heat-resistant flexible laminate for substrate of printed circui

1986-02-04

1987-01-27

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156329, 156629, 156643, 156646, 156668, 156902, B32B 3100, B29C 1708

Patent

active

046392858

ABSTRACT:
The invention provides a flexible metal-foiled laminate of an insulating base film of a synthetic resin, e.g. polyimide, and a metal, e.g. copper, foil adhesively bonded together and suitable for use as a base plate for printed circuit boards by virtue of the high heat resistance and greatly increased adhesive bonding strength between the base film and the metal foil. The laminate is prepared by use of a silicone-based adhesive and the surface of the base film is, prior to adhesive bonding, subjected to a treatment of exposure to an atmosphere of low temperature plasma generated in a gaseous organosilicon compound such as trimethyl ethoxy silane, optionally, diluted with an inorganic gas such as oxygen.

REFERENCES:
patent: 4329385 (1982-05-01), Banks et al.
patent: 4396450 (1983-08-01), Blenner et al.
patent: 4466874 (1984-08-01), Belke et al.
patent: 4504349 (1985-03-01), Ueno et al.
patent: 4549921 (1985-10-01), Wolfe

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