Heat-resistant film base-material-inserted B-stage resin...

Details Heat-resistant film base-material-inserted B-stage resin... Heat-resistant film base-material-inserted B-stage resin...

2005-03-15

2005-03-15

Lam, Cathy F. (Department: 1775)

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

C428S901000, C174S258000

Reexamination Certificate

active

06866919

ABSTRACT:
The present invention relates to a heat-resistant film base-material-inserted B-stage resin composition sheet for producing a multilayer printed wiring board which is excellent in copper adhesive strength, heat resistance and insulating reliability particularly in the Z direction and is suitable for use, as a high density small printed wiring board, in a semiconductor-chip-mounting, small-sized and lightweight novel semiconductor plastic package, and to a use thereof.

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patent: 5670250 (1997-09-01), Sanville et al.
patent: 5965245 (1999-10-01), Okano et al.
patent: 6245696 (2001-06-01), Haas et al.
patent: 6362436 (2002-03-01), Kimbara et al.
patent: 6562179 (2003-05-01), Ikeguchi et al.

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