Heat-resistant electrical insulating layer

Details Heat-resistant electrical insulating layer Heat-resistant electrical insulating layer

1994-01-21

1996-05-07

Ryan, Patrick J.

Stock material or miscellaneous articles

Composite

428209, 428273, 428426, 428457, 428626, 428901, 361750, B32B 2700

Patent

active

055144756

ABSTRACT:
A heat-resistant, electrical insulating layer which is suitable for use as an insulating substrate in printed circuit boards and as an insulating film for semiconductor devices and which surpasses a polyimide-based insulating layer with respect to heat resisting properties, dielectric properties, and water absorption. The insulating layer comprises a polycondensed fused polycyclic, polynuclear aromatic resin prepared by a polycondensation reaction of a starting material with a crosslinking agent in the presence of an acid catalyst. The starting material is selected from the group consisting of fused polycyclic aromatic hydrocarbons which may have a hydroxyl group as a ring substituent and mixtures of a fused polycyclic aromatic hydrocarbon and a monocyclic aromatic hydrocarbon both of which may have a hydroxyl group as a ring substituent. The crosslinking agent is an aromatic compound having at least two hydroxymethyl or halomethyl groups as ring substituents.

REFERENCES:
patent: 4758653 (1988-07-01), Otani et al.
patent: 5017683 (1991-05-01), Otani et al.
patent: 5126467 (1992-06-01), Itagaki et al.

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