Heat resistant composite film

Details Heat resistant composite film Heat resistant composite film

1991-08-19

1993-05-25

Thibodeau, Paul J.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Physical dimension specified

428412, 4284735, 4284744, 4284752, 428480, 528342, 528345, B32B 2736

Patent

active

052138909

ABSTRACT:
A heat resistant composite film is described, which comprises (I) a thermoplastic film and (II) a cured layer of a thermosetting resin composition comprising (A) 100 parts by weight of an aliphatic diamine having a spiroacetal ring, (B) from 5 to 150 parts by weight of an ester derived from maleic acid and an alcohol represented by formula (I), and (C) from 20 to 250 parts by weight of an ester derived from a tetracarboxylic acid and an alcohol represented by formula (I),

REFERENCES:
Patent Abstracts of Japan, unexamined applications, C field, vol. 11, No. 290, Sep. 18, 1987 The Patent Office Japanese Government p. 103 C 447, *Kokai-No. 62-84 121 (Mitsubishi Petrochem. Co. Ltd.).
Database WPIL, abstract No. 90-160 714; Derwent Publications Ltd., London GB *Abstract* & JP-A-02-103 136 (Dainippon Printing K.K.) (Apr. 16, 1990).
Patent Abstracts of Japan, unexamined applications, C field, vol. 14, No. 555, Dec. 10, 1990 The Patent Office Japanese Government p. 100 c 786, *Kokai-No. 02-238-023 (Mitsubishi Petrochem. Co. Ltd.)*.

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