Heat-resistant bonding materials

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – From carboxylic acid or derivative thereof

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528 26, 528 38, 528125, 528126, 528128, 528170, 528172, 528176, 528182, 528185, 528188, 528220, 528224, 528229, 528351, 4284735, C08G 7310, C08G 6926, C08G 802

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active

052801020

ABSTRACT:
Heat-resistant bonding materials are composed of a polyimide precursor end-capped at molecule ends thereof and/or an imide compound formed from the polyimide precursor. They may also contain fine particles of at least one material selected from metals, metal oxides, metal carbides and metal nitrides.

REFERENCES:
patent: 4686147 (1987-08-01), Matsuyama et al.
patent: 4748228 (1988-05-01), Shoji et al.
patent: 4824731 (1989-04-01), Matsuyama et al.
patent: 4956450 (1990-09-01), Lee et al.
ECC. Proc. 374h:1987, pp. 96-109.
Derwent Accession No. 89-089 995.
Chemical Ab. 105:44894k "Electroconductive Resin Compositions", Yamagushi et al.
"Whithington's Dictionary of Plastics Surfactants", p. 233.

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