Heat-resistant adhesive for use especially in making sterilizabl

Details Heat-resistant adhesive for use especially in making sterilizabl Heat-resistant adhesive for use especially in making sterilizabl

1995-04-27

1997-02-25

Marquis, Melvyn I.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

525430, C08K 320, C08L 6302

Patent

active

056059442

ABSTRACT:
Polyamide/epoxy, thermoplastic-thermoset curable adhesive resin systems which are aqueous dispersions are disclosed; wherein the epoxy resin component has unreacted epoxy groups numbering, on average, between about 2 and about 8; the polyamide component comprises both an acid terminated polyamide resin having an acid number, on average, of from about 10 to about 30, in an amount of from about 20% to about 60% by weight of the total weight of polyamide resin, and an amine terminated polyamide resin having an amine number, on average, of from about 5 to about 30, in an amount of from about 80% to about 40% by weight of the total weight of polyamide resin; and additionally a neutralizing base in amount sufficient to neutralize from about 50% to about 80%, on an equivalents basis, of the total number of free acid groups occurring on the acid and amine terminated polyamide resin components; and optionally at least one water soluble, dipolar chemical moiety in an amount effective to provide stability in the overall resin composition; and optionally a surfactant. The disclosed adhesive resin systems exhibit stability to separation, premature curing or significant reaction at room temperature for at least six months, and are capable of forming an adhesive bond at elevated temperatures which, once formed, will maintain its integrity under the high temperature, pressure and moisture conditions of autoclave sterilization. They find particular application in producing packaging containers for enclosing and isolating an object to be sterilized, e.g., a surgical instrument.

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