Heat resistant adhesive composition

Details Heat resistant adhesive composition Heat resistant adhesive composition

1991-12-02

1993-01-19

Bleutge, John C.

Stock material or miscellaneous articles

Structurally defined web or sheet

Including components having same physical characteristic in...

428416, 428448, 428450, 4284735, 528 27, 528 40, 528 41, 528 33, 525431, 525487, 525523, B32B 702, C08F28310, C08F28312

Patent

active

051806274

ABSTRACT:
The disclosed heat resistant adhesive composition comprises a polyimidesiloxane obtained from a biphenyltetracarboxylic acid or its derivative and a diamine composition comprising a diaminopolysiloxane and an aromatic diamine, an epoxy compound having an epoxy group, and an epoxy compound-hardening agent. An adhesive film and a composite sheet utilizing the heat resistant resinous composition are also disclosed.

REFERENCES:
patent: 4511701 (1985-04-01), Ryang
patent: 4794148 (1988-12-01), Nakamura et al.
patent: 4808676 (1989-02-01), Nishi et al.
patent: 4973645 (1990-11-01), Lee
patent: 5006614 (1991-04-01), Itoh et al.
patent: 5041474 (1991-08-01), Kim et al.
patent: 5061774 (1991-10-01), Park et al.

Affiliated with

Also associated with

Rating

Heat resistant adhesive composition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat resistant adhesive composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat resistant adhesive composition will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-101494