Heat resistance copper alloy materials

Details Heat resistance copper alloy materials Heat resistance copper alloy materials

2003-09-19

2009-10-27

Ip, Sikyin (Department: 1793)

Metal treatment

Stock

Copper base

C420S472000, C420S473000, C420S475000

Reexamination Certificate

active

07608157

ABSTRACT:
The present invention discloses a heat resistance copper alloy material characterized in that said copper alloy material comprises 0.15 to 0.33 mass percent of Co, 0.041 to 0.089 mass percent of P, 0.02 to 0.25 mass percent of Sn, 0.01 to 0.40 mass percent of Zn and the remaining mass percent of Cu and inevitable impurities, wherein each content of Co, P, Sn and Zn satisfies the relationships 2.4≦([Co]−0.02)/[P]≦5.2 and 0.20≦[Co]+0.5[P]+0.9[Sn]+0.1[Zn]≦0.54, wherein [Co], [P], [Sn] and [Zn] are said mass percents of Co, P, Sn and Zn content, respectively; and said copper alloy material is a pipe, plate, bar, wire or worked material obtained by working said pipe, plate, bar or wire material into predetermined shapes.

REFERENCES:
patent: 01-108322 (1989-04-01), None
patent: 04-272148 (1992-09-01), None
patent: 06-094390 (1994-04-01), None
patent: 10-130754 (1998-05-01), None
patent: 10-130754 (1998-05-01), None
patent: 10-168532 (1998-06-01), None
patent: 11-097609 (1999-04-01), None
patent: 11-256255 (1999-09-01), None

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