Heat-removing circuit boards

Details Heat-removing circuit boards Heat-removing circuit boards

1983-08-22

1985-01-22

Kucia, R. R.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

361386, 361387, H05K 105

Patent

active

044953780

ABSTRACT:
The invention relates to circuit boards consisting of a flat core plate, 1 to 5 mm thick, of metallic material, graphite or electrically conductive carbon with a coating, 10 to 80 .mu.m thick, of electroplated aluminum eloxal and, optionally, an intermediate layer of copper or silver, 0.1 to 2 .mu.m thick. On the electroplated Al eloxal layer, a conductor run structure generated by an additive or subtractive technique may be present. The highly heat-conducting and mechanically strong circuit boards find application in electronics.

REFERENCES:
patent: Re29784 (1978-09-01), Chadwick
patent: 2923860 (1960-02-01), Miller
patent: 3165672 (1965-01-01), Gellert
patent: 3213184 (1965-10-01), Bondley
patent: 3296099 (1967-01-01), Dinella
patent: 4130855 (1978-12-01), Smolko
patent: 4141029 (1979-02-01), Dromsky
Laland Teschler, New Circuit Boards Beat Heat and Vibration, Machine Design, V. 51 #2, Jan. 1979, pp. 105 to 109.

Affiliated with

Also associated with

Rating

Heat-removing circuit boards does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat-removing circuit boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat-removing circuit boards will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-567905