Heat releasing member, package for accommodating...

Details Heat releasing member, package for accommodating... Heat releasing member, package for accommodating...

2005-07-26

2005-07-26

Wilson, Allan R. (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S706000, C257S704000, C257S675000, C257S720000, C257S762000, C257S796000

Reexamination Certificate

active

06921971

ABSTRACT:
A package for accommodating a semiconductor element includes a heat releasing member having a mounting portion for a semiconductor element, a frame having a wiring conductor, and a lid attached so as to cover the mounting portion. In the heat releasing member, a plurality of through-metal members made of a copper are buried in the mounting portion of a substrate made of a matrix of tungsten or molybdenum and copper to another surface. Copper layers are joined at least to upper and lower surfaces of a portion in which the through-metal members are buried, and a cross-section area of each of the through-metal members is gradually increased from the center side of the substrate to a joint portion with the copper layers.

REFERENCES:
patent: 5783857 (1998-07-01), Ziegner et al.
patent: 6045927 (2000-04-01), Nakanishi et al.
patent: 09-045828 (1997-02-01), None
patent: 9-312361 (1997-12-01), None

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