Heat reduction system for transistor assemblies

Details Heat reduction system for transistor assemblies Heat reduction system for transistor assemblies

1998-02-19

2000-10-24

Williams, Alexander O.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257714, 257715, 257716, 257699, 257723, C23C 1434, H01L 2504, H01L 2302, H01L 3902

Patent

active

061371696

ABSTRACT:
A power module or other circuit is formed with transistor assemblies, each having one or more semiconductor slices electrically connected to one another and fixed to a supporting system. The supporting system includes a tubular element suited to allow the flood of a refrigerating and insulating fluid in the inside and which has the semiconductor slices directly welded on its external surface.

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