Heat recoverable article and methods using same

Details Heat recoverable article and methods using same Heat recoverable article and methods using same

1977-01-24

1979-12-18

Lesmes, George F.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156 78, 156 85, 174 77R, 174 84R, 174151, 174DIG8, 264342R, 428131, 428137, 428322, 428913, B32D 310, B29C 2700

Patent

active

041793196

ABSTRACT:
A laminated sealing article comprising a layer of adhesive sandwiched between a pair of cross-linked, dimensionally heat unstable wafers of polymeric material. The article is provided with a plurality of apertures adapted to receive a corresponding plurality of substrates. The gaps between the plurality of substrates are sealed by heating the article to the recovery temperature of the wafers. This heating causes the layer of adhesive to bond to the substrates and the wafers to recover around the substrates thereby forming a seal between all of the substrates and the article. The heat recoverable article of the invention is particularly well adapted for use in a method of environmentally sealing the rear of an electrical connector of the type having a plurality of individually insulated electrical conductors extending from a tubular rear portion.

REFERENCES:
patent: 2739829 (1956-03-01), Pedlow et al.
patent: 3086242 (1963-04-01), Cook et al.
patent: 3276929 (1966-10-01), Ferch
patent: 3382121 (1968-05-01), Sherlock
patent: 3539411 (1970-11-01), Heslop et al.
patent: 3669824 (1972-06-01), Hess
patent: 3749621 (1973-07-01), Shoffner
patent: 3758353 (1973-09-01), Huriez
patent: 3910448 (1975-10-01), Evans et al.
patent: 3985951 (1976-10-01), Harris
patent: 3990661 (1976-11-01), De Groef

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