Heat radiator for electronic device and method of making it

Details Heat radiator for electronic device and method of making it Heat radiator for electronic device and method of making it

2005-07-12

2005-07-12

Harvey, Minsun Oh (Department: 2828)

Coherent light generators

Particular temperature control

Heat sink

C372S034000

Reexamination Certificate

active

06917638

ABSTRACT:
A heat radiator for dissipating heat from an electronic device, which is mounted on a board or which is installed in a casing, to the outside thereof is basically composed of a substrate having plenty of through holes, which are produced by press molding and sintering. The substrate having a low thermal expansion coefficient is made of a copper-tungsten alloy or a copper-molybdenum alloy in which the copper content is smaller than the tungsten content or molybdenum content. The through holes each having a circular shape or a rectangular shape are infiltrated with the compound having a high thermal conductivity and composed of a copper-tungsten alloy or a copper-molybdenum alloy in which the copper content is greater than the tungsten content or molybdenum content. Thus, the heat radiator allows thermal conduction along axial directions of the through holes while substantially avoiding unwanted thermal expansion thereof.

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