Heat radiator assembly

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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Details

165185, 174 16HS, 361388, H05K 720

Patent

active

046213040

ABSTRACT:
A heat radiator assembly conducts the heat generated by electronic parts mounted on a printed board, such as integrated circuits, resistors, and semiconductor elements, through first and second heat sinks to a shield case, so that the heat is radiated therefrom and thus natural air cooling is effected. The first heat sink is provided on the shield case, and the second heat sink is passed through a through hole in the shield case and the first heat sink and is threadedly engaged with the first heat sink, to engage the electronic parts. If necessary, a lock nut or a lock screw may be used for fixing the threaded engagement of the second heat sink.

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patent: 4069498 (1978-01-01), Joshi
patent: 4167031 (1979-09-01), Patel
patent: 4254431 (1981-03-01), Babuka
Ronkese, "Metal Wood Heat Stud", IBM Technical Disclosure Bulletin, vol. 20, No. 3, 8/77, pp. 1122-1123.
Bakos et al, "Programmable Heat Sink Device for Thermal Enhancement", IBM Technical Disclosure Bulletin, vol. 22, No. 3, 8/79, p. 957.
Doo et al, "Controlled Gap in Semiconductor Packages", IBM Technical Disclosure Bulletin, vol. 20, No. 4, 9/77, p. 1433.
Parsapour, "Hook and Loop Thermal Conductive Mesh", IBM Technical Disclosure Bulletin, vol. 21, No. 9, 2/79, p. 3672.
Darrow et al, "Stack Structure for Mixed Technology Thermal Enhancement", IBM Technical Disclosure Bulletin, vol. 22, No. 3, 8/79, pp. 958-959.

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