Heat radiation structure of semiconductor element and heat sink

Details Heat radiation structure of semiconductor element and heat sink Heat radiation structure of semiconductor element and heat sink

2008-04-29

2008-04-29

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S713000

Reexamination Certificate

active

07365425

ABSTRACT:
According to a heat radiation structure of a semiconductor element of the invention, by providing a recess for a thermal conductive sheet on the bottom surface of a mounting seat of a heat sink, disposing the thermal conductive sheet in this recess, and screwing a source electrode of a power FET on the bottom surface of the mounting seat of the heat sink, it is possible to efficiently radiate the heat generated by the semiconductor element without damaging semiconductor chips in the interior of the semiconductor element and without deteriorating electrical properties.

REFERENCES:
patent: 5969950 (1999-10-01), Tantoush
patent: 6275381 (2001-08-01), Edwards et al.
patent: 4-167455 (1992-06-01), None
patent: 5-62048 (1993-08-01), None

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