Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2004-04-13
2009-08-25
Parker, Kenneth A (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S706000, C257S707000, C257S704000, C257S730000, C438S122000, C438S125000
Reexamination Certificate
active
07579688
ABSTRACT:
The invention of the present application provides a heat radiation structure of a semiconductor device, and includes a substrate having, on a surface thereof, a first area on which the semiconductor device is mounted, and a second area which surrounds the first area. The semiconductor device has a first surface and a second surface opposite to the first surfaces, and is formed with a plurality of terminals provided on the first surface. The semiconductor device is mounted on the substrate in such a manner that the first surface is opposite to the surface of the substrate. A first heat radiating film is formed on the second area of the substrate, and a second heat radiating film is formed on the second surface of the semiconductor device, with the second heat radiating film being spaced apart from the first heat radiating film.
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Nguyen Joseph
Oki Semiconductor Co., Ltd.
Parker Kenneth A
Rabin & Berdo P.C.
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