Thermal measuring and testing – Calorimetry – Total radiant energy or power measurement
Patent
1987-04-14
1988-09-13
Yasich, Daniel M.
Thermal measuring and testing
Calorimetry
Total radiant energy or power measurement
250352, 338 18, G01J 510, G01K 1706
Patent
active
047705418
DESCRIPTION:
BRIEF SUMMARY
BACKGROUND OF THE INVENTION
The invention relates to a heat radiation sensing device. Such a sensing device has already been disclosed, for example, in "Sensor zum Messen der Waermestrahlung an Arbeitsplaetzen," Technisches Messen, Ig. 51, 1984, Heft 6, 8. 213 ff, in which two receiver surfaces consisting of sheet copper are exposed to heat radiation, wherein each receiver sheet comprises a temperature sensing device, which is glued to the rear side, so that the different temperatures, which occur due the fact that one of the receiver sheets is blackened and the other gold-plated, can be measured directly with this sensing device. The entirety is accommodated in a housing consisting of brass. Because of the relatively complicated construction, such a sensing device is not suitable for large-series production, which is the case, for example, in a sensing device which is to be used in a motor vehicle in connection with an air conditioning system.
SUMMARY OF THE INVENTION
It is an object of this invention to provide an improved head radiation sensing device.
The heat radiation sensing device, according to the invention has the advantage that it is simple to produce and, therefore, is also suitable for large-series production, but is mechanically very stable. Moreover, it is small and light and can therefore be fixed at any required location, for example, by means of gluing. The arrangement provides a single measuring signal which can be used in a simple manner, for example, to control a shutter.
It is particularly advantageous that the covering, which is pervious to heat radiation, consist of a polyimide, e.g. a Kapton foil, which is provided with a thin gold layer on one side by means of the application of a gold resinate and subsequent heat treatment at 300.degree. to 350.degree. C. If it is provided that the ceramic substrate on which the resistors are located is fixed in the frame in such a way that only the edge of the substrate is supported on a corresponding projection of the frame and the remaining portion of the substrate is open, then a minimal effective heat capacity is achieved with good mechanical stability of the substrate.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 shows a perspective view of the heat radiation sensing device and
FIG. 2 shows a section through the device of FIG. 1.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
The heat radiation sensing device includes a frame 11 of duroplastic plastics material in which is located the ceramic substrate 5, which comprises two radiation-sensitive resistors 1 and 2, as well as two resistors 3 and 4, which are not sensitive to temperature and are connected with one another via conductor paths 6 in the form of a bridge circuit. A portion of the ceramic substrate 5 projects from the frame 11 and, together with the conductor path terminals 7, 8, 9 and 10, forms the connection of the sensing device. Within the frame 11, the ceramic substrate, as shown in FIG. 2, is supported only by the edge 15 lying on a corresponding projection 16 of the frame 11 so that the major portion of the ceramic substrate 5 has no direct contact with the frame 11. A covering 12, which is pervious, in its entirety, to heat radiation and carries a layer 14 of noble metal on its rear side, is located on the frame 11 at a distance of approximately 1 mm from the ceramic substrate 5, wherein this layer comprises a window 13 over the radiation-dependent resistor 1. By means of this, the resistor 1, which carries a black lacquer layer, in addition, is exposed to the heat radiation, while this is not true of the second radiation-dependent resistor 2 because of the reflecting noble metal layer 14. The covering 12 can be either formed of a glass which is pervious to infrared radiation, e.g. Robax glass from the Schott company, or a polyimide foil, e.g. Kapton foil from the Dupont company.
In order to produce the heat radiation sensing device the conductor path pattern 6, with the connections 7, 8, 9 and 10, are first pressed on a thin ceramic plate, preferably made of alumin
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Patent Abstracts of Japan, vol. 4, No. 62, [pp. 10, 544] 5/9/80, and #5,531,977 to Sangyo et al, 3/6/80 patent.
De La Prieta Claudio
Fedter Horst
Grunwald Werner
Nolting Peter
Schmid Kurt
Robert & Bosch GmbH
Striker Michael J.
Yasich Daniel M.
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