Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-08-14
2007-08-14
Thompson, Gregory (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C165S080300, C165S185000, C257S719000, C361S710000, C361S719000
Reexamination Certificate
active
10958700
ABSTRACT:
There is disclosed a heat radiation device for memory modules intended for radiating heat that is generated from a memory module group wherein a plurality of memory modules equipped with memory elements on both the front and rear face sides of a substrate are placed in parallel. The device comprises heat radiation plates in pairs composed of front face side heat radiation plates in contact with memory elements that are installed on the front face side of the substrate for each of the memory modules, and of rear face side heat radiation plates in contact with memory elements that are installed on the rear face side of the substrate; and connecting members for heat radiation plates in pairs which connect the heat radiation plates in pairs so that heat is conducted among a plurality of the heat radiation plates in pairs.
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Japanese Office Action dated Oct. 19, 2005 for corresponding Japanese Application 2003-347404, with partial translation.
Elpida Memory Inc.
Katten Muchin & Rosenman LLP
Thompson Gregory
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