Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2001-04-05
2001-11-13
Picard, Leo P. (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S717000, C361S718000, C361S719000, C257S718000, C257S719000, C165S080300, C174S016300
Reexamination Certificate
active
06317328
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention is related to an improved heat-radiating module structure, and more particularly to a heat-radiating module structure in which when detached, the fastening bolt and the resilient member are restricted from bounding away from the locking socket of the heat-radiating module. Therefore, the fastening bolt and the resilient member will not unexpectedly bound out and miss and the assembly of the heat-radiating module is facilitated.
In a conventional heat-radiating module structure, (especially that applied to CPU of a portable computer) the circuit board is formed with locating thread holes around a heat source (such as CPU) mounted on the circuit board. The heat-radiating module is formed with through holes corresponding to the locating thread holes. When assembled, bolts are directly fitted into a spring and passed through the through hole of the heat-radiating module and screwed into the locating thread hole of the circuit board. By means of the resilient force of the spring compressed between the bolt and the heat-radiating module, the heat-radiating module can exert a certain resilient pressure onto the heat source so as to locate the same without loosening.
When detaching the heat-radiating module from the heat source for maintenance or repair, in the instant of unscrewing the bolt from the locating thread hole of the circuit board, the spring and the bolt often bound away from the heat-radiating module and miss. As a result, when re-assembled, it is often necessary to find the parts and re-aim the respective parts at each other and re-fit the parts with each other. This leads to great inconvenience in maintenance and assembly.
SUMMARY OF THE INVENTION
It is therefore a primary object of the present invention to provide an improved heat-radiating module structure. The heat-radiating module is formed with locating sockets corresponding to locating thread holes of a circuit board on which a heat source is mounted. The center of the bottom of the locating socket is formed with a restricting thread hole. A first screw section formed on middle portion of a fastening bolt is screwed through the restricting thread hole. A second screw section with smaller outer diameter is formed at lower end of the fastening bolt under the first screw section. A resilient member is disposed in the locating socket of the heat-radiating module and fitted on the fastening bolt. The first screw section is screwed through the restricting thread hole and the second screw section is screwed into the locating thread hole of the circuit board. When the second screw section is unscrewed from the locating thread hole, the first screw section abuts against a lower side of the restricting thread hole and is stopped thereby so as to prevent the fastening bolt and the resilient member from bounding away. Therefore, the maintenance and assembly efficiency can be enhanced.
It is a further object of the present invention to provide the above heat-radiating module structure in which an annular groove is formed on the bottom of the locating socket of the heat-radiating module. The bottom end of the resilient member is inlaid and firmly located in the annular groove to facilitate assembly.
The present invention can be best understood through the following description and accompanying drawings wherein:
REFERENCES:
patent: 5648893 (1997-07-01), Loo et al.
patent: 5757621 (1998-05-01), Patel
patent: 5901039 (1999-05-01), Dehaine et al.
patent: 6212074 (2001-04-01), Gonsalves et al.
Bacon & Thomas PLLC
Chervinsky Boris L.
Compal Electronics Inc.
Picard Leo P.
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