Heat exchange – With coated – roughened or polished surface
Patent
1996-02-22
1998-06-09
Flanigan, Allen J.
Heat exchange
With coated, roughened or polished surface
165904, 165DIG512, F28F 1318
Patent
active
057621314
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
The present invention relates to a heat radiating board based on a novel principle, capable of dissipating heat with high efficiency from a zone which is brought to a high temperature by the generation of heat during use, including electric appliances such as television sets, computers and motors, engines and radiators of automobiles, various kinds of machine manufacturing apparatuses and the like to a zone at a low temperature as well as to a cooling method by utilizing the same.
BACKGROUND ART
Known methods for decreasing the temperature of a high temperature zone by dissipating the heat from the high temperature zone to a low temperature zone include the methods in which the low temperature zone side is cooled with air or water through a metal plate having good heat conductivity or, namely, the air cooling method and water cooling method.
In order to enhance the cooling efficiency of the metal plate, the surface facing the low temperature zone is ruggedly shaped or the surface is provided with a large number of fins or heat radiating auxiliary bodies to increase the contact area with the cooling medium (Japanese Utility Model Kokai No. 62-52770), and a film of water is formed on the surface to promote cooling by utilizing the heat of vaporization thereof (Japanese Patent Publication No. 6-3335), etc.
However, shaping of the surface to impart ruggedness or providing fins or heat radiating auxiliary bodies on the surface have defects in that a special working process is required and, in addition, cleaning works when stains are troublesome and it is not applicable to a part where smoothness of the surface is required, while the method utilizing the heat of vaporization is not free from limitations in the applicable ranges because a special apparatus is required for the formation of a film of water on the metal surface.
DISCLOSURE OF INVENTION
The present invention has been completed with an object to provide a heat radiating board based on a completely novel principle, having a simple structure and still exhibiting a high efficiency of heat radiation by overcoming the defects in a heat radiating board heretofore used in the air cooling method or water cooling method.
The inventors have conducted investigations on the mechanism for cooling of a high temperature zone through a heat radiating board disposed between the high temperature zone and a low temperature zone and, as a result, obtained the information which follows.
More specifically, when heat is transferred by radiation or convention to the surface of a heat radiating board facing a high temperature zone, the heat on the surface facing the high temperature zone is transferred to the surface facing the low temperature zone in the mode of conduction. Being contacted with a cooling fluid at the surface facing the low temperature zone, the heat is transferred to the cooling fluid. The temperature decrease of the heat radiating board in contact with the cooling fluid takes place more rapidly as the total heat volume of the material constituting the heat radiating board is decreased.
When a layer having a small total heat volume is provided on the surface of the heat radiating body facing the low temperature zone, an equilibrium is maintained in this layer between the heat transferred from the heat radiating body and the heat removed by the cooling fluid so that, assuming that the heat removed by convection is identical, the temperature of the surface facing the low temperature zone is decreased more as compared with the case of the heat radiating board alone, resulting in promotion of heat transfer taking place through the heat radiating board from the surface facing the high temperature zone.
Following is a numerical equation expressing the state of this heat flow. ##EQU1## Where, q is the heat flow, .alpha..sub.1 is the heat transfer coefficient of the fluid in the high temperature zone, .alpha..sub.0 is the heat transfer coefficient of the fluid in the low temperature zone, T.sub.r is the temperature of the fluid in the high tem
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Kujirai Masami
Kujirai Yukio
Kujirai Yumiko
Flanigan Allen J.
Kabushiki Kaisha Sekuto Kagaku
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