Heat radiating apparatus of electronic component

Details Heat radiating apparatus of electronic component Heat radiating apparatus of electronic component

2007-03-27

2007-03-27

Thompson, Greg (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080300, C165S185000, C257S719000

Reexamination Certificate

active

11044629

ABSTRACT:
A heat radiating apparatus includes a radiator adhering to an electronic component mounted on a circuit board via an elastic member provided on the circuit board so that the electronic component is cooled. The radiator includes a plurality of projection parts, the elastic member includes an engaging part configured to engage the projection part and a radiator insert hole forming part where the radiator is inserted, and a pushing force is applied from the elastic member to the radiator by rotating the radiator so that the projection part is engaged by the engaging part, and thereby a bottom surface of the radiator is adhered to the electronic component.

REFERENCES:
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patent: 5708564 (1998-01-01), Lin
patent: 4-264760 (1992-09-01), None
patent: 4-284654 (1992-10-01), None
patent: 6-196883 (1994-07-01), None
patent: 9-298259 (1997-11-01), None
International Search Report dated Apr. 15, 2003.

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