Heat pump with secondary loop air-conditioning system

Details Heat pump with secondary loop air-conditioning system Heat pump with secondary loop air-conditioning system

2006-06-20

2006-06-20

Ford, John K. (Department: 3753)

Heat exchange

With timer, programmer, time delay, or condition responsive...

Having heating and cooling capability

C165S042000, C165S043000, C237S00200B, C237S01230B, C062S238600, C062S196400, C062S503000, C062S434000, C062S435000, C062S244000

Reexamination Certificate

active

07063137

ABSTRACT:
A chiller-condenser is disposed downstream of a condenser and a chiller-evaporator is disposed downstream of the chiller-condenser. A main three-way valve is disposed between the compressor and the condenser for directing flow from the compressor to the condenser in the air-conditioning mode and for directing flow from the compressor through a by-pass line to the chiller-condenser in the heat pump mode. A heat pump (HP) expansion device shown as an orifice tube expands the refrigerant in the heat pump mode and an by-pass valve is disposed between the chiller-condenser and the chiller-evaporator for directing flow from the chiller-condenser through the heat pump expansion device and to the chiller-evaporator in the heat pump mode. An air-conditioning (A/C) expansion device shown as orifice tube is disposed downstream of the condenser and upstream of the by-pass line for expanding the refrigerant in the air-conditioning mode.

REFERENCES:
patent: 2801827 (1957-08-01), Dolza
patent: 4616484 (1986-10-01), Mehdi et al.
patent: 5291941 (1994-03-01), Enomoto et al.
patent: 5491983 (1996-02-01), Hamilton et al.
patent: 6230508 (2001-05-01), Baker et al.
patent: 6405793 (2002-06-01), Ghodbane et al.
patent: 6422308 (2002-07-01), Okawara et al.
patent: 2001/0020529 (2001-09-01), Karl
patent: 1 112 873 (2001-07-01), None
patent: 1 112 873 (2001-07-01), None
patent: 1 295 739 (2003-03-01), None
patent: 06143974 (1994-05-01), None
patent: 11301254 (1999-11-01), None

Affiliated with

Also associated with

Rating

Heat pump with secondary loop air-conditioning system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat pump with secondary loop air-conditioning system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat pump with secondary loop air-conditioning system will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3617961