Heat pump assembly

Details Heat pump assembly Heat pump assembly

2007-12-06

2011-10-11

Ali, Mohammad (Department: 3784)

Refrigeration

Structural installation

Geographic, e.g., subterranean feature

C062S324100

Reexamination Certificate

active

08033128

ABSTRACT:
Heat pump assembly for seasonal balancing of temperatures in buildings, includes a heat pump (1) having a cold side and a warm side, respectively. The heat exchangers (2, 3) are connected to the cold and the warm side, respectively, in that one of the heat exchangers (3) is connected to a heating/cooling element (4), in that the other heat exchanger (2) is connected to a heat/cold buffer (6), in that the heat pump (1) is of the type liquid-liquid, and in that a valve assembly (7) is arranged in the heat pump (1) to optionally connect the warm or cold side of the heat pump (1) to the heating/cooling element (4), whereby the heating/cooling element (4) optionally may heat or cool.

REFERENCES:
patent: 3782132 (1974-01-01), Lohoff
patent: 3965694 (1976-06-01), Vignal et al.
patent: 4237963 (1980-12-01), Girard
patent: 4257239 (1981-03-01), Partin et al.
patent: 4327560 (1982-05-01), Leon et al.
patent: 4392531 (1983-07-01), Ippolito
patent: 4522253 (1985-06-01), Levin
patent: 4718248 (1988-01-01), Fisher
patent: 5038580 (1991-08-01), Hart
patent: 5140829 (1992-08-01), Barwacz
patent: 5388419 (1995-02-01), Kaye
patent: 5461876 (1995-10-01), Dressler
patent: 5533355 (1996-07-01), Rawlings
patent: 5678626 (1997-10-01), Gilles
patent: 6332335 (2001-12-01), Kajimoto et al.
patent: 6405551 (2002-06-01), Kuwabara et al.
patent: 6427453 (2002-08-01), Holtzapple et al.
patent: 6449973 (2002-09-01), Dodge et al.
patent: 6536677 (2003-03-01), Melendez-Gonzalez et al.
patent: 6615601 (2003-09-01), Wiggs
patent: 6655155 (2003-12-01), Bishop
patent: 6990826 (2006-01-01), Lifson et al.
patent: 7032398 (2006-04-01), Dilk et al.
patent: 7082779 (2006-08-01), Xu
patent: 7124597 (2006-10-01), Kattner et al.
patent: 7254955 (2007-08-01), Otake et al.
patent: 7401475 (2008-07-01), Hugenroth et al.
patent: 7681410 (2010-03-01), Bean, Jr.
patent: 2003/0042014 (2003-03-01), Jin
patent: 90/02300 (1990-03-01), None
International Search report dated Apr. 2, 2008, from corresponding PCT application.

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