Heat processing apparatus for semiconductor process

Details Heat processing apparatus for semiconductor process Heat processing apparatus for semiconductor process

2011-08-23

2011-08-23

Kackar, Ram N (Department: 1716)

Coating apparatus

Gas or vapor deposition

C156S345330, C156S345340

Reexamination Certificate

active

08002895

ABSTRACT:
A heat processing apparatus for a semiconductor process includes a reaction tube including a process field configured to store a plurality of target substrates stacked at intervals. A gas supply duct is integrally provided outside the wall of the reaction tube to extend vertically in a range that covers the process field. A plurality of gas delivery holes are formed in the side portion of the wall of the reaction tube, to be vertically arrayed in a range that covers the process field and communicate with the gas supply duct. A gas supply system is connected to a bottom portion of the gas supply duct to supply a process gas to the process field through the gas supply duct and the plurality of gas delivery holes.

REFERENCES:
patent: 5217560 (1993-06-01), Kurono et al.
patent: 5273424 (1993-12-01), Kobayashi
patent: 5709757 (1998-01-01), Hatano et al.
patent: 5925188 (1999-07-01), Oh
patent: 5958140 (1999-09-01), Arami et al.
patent: 6142773 (2000-11-01), Shimazu
patent: 6444262 (2002-09-01), Kitamura et al.
patent: 6807971 (2004-10-01), Saito et al.
patent: 6847015 (2005-01-01), Wang et al.
patent: 6881295 (2005-04-01), Nagakura
patent: 2004/0025786 (2004-02-01), Kontani et al.
patent: 2004/0094091 (2004-05-01), Yang et al.
patent: 2004/0099216 (2004-05-01), Koh et al.
patent: 2005/0272271 (2005-12-01), Furuya et al.
patent: 1701133 (2005-11-01), None
patent: 05-070299 (1993-03-01), None
patent: 5-70299 (1993-03-01), None
patent: 08-186081 (1996-07-01), None
patent: 2000-299287 (2000-10-01), None
patent: 2003-203871 (2003-07-01), None
patent: 2004-260204 (2004-09-01), None
Chinese Office Action issued on Nov. 27, 2009 for Chinese Application No. 200710140224.2 with partial English language translation.

Affiliated with

Also associated with

Rating

Heat processing apparatus for semiconductor process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat processing apparatus for semiconductor process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat processing apparatus for semiconductor process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2749330