Heat pipes inserted into first and second parallel holes in a bl

Details Heat pipes inserted into first and second parallel holes in a bl Heat pipes inserted into first and second parallel holes in a bl

1996-10-25

1998-10-13

Phillips, Michael W.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361700, 622592, 16510433, 174 152, G06F 120, H05K 720, F28D 1502

Patent

active

058221875

ABSTRACT:
The apparatus is a device for transferring heat across the hinged joint between the two sections of the case of a laptop computer. Two simple heat pipe cylinders are inserted into parallel cylindrical holes in a heat conductive block. One cylinder is bonded within its hole, and the other cylinder is permitted to rotate within its hole. The axis of the rotatable cylinder is located in line with the axis of the mechanical hinges which permit the panels to pivot relative to each other. A heat producing device in one panel can be then attached to one heat pipe, and a heat sink on the other panel can be attached to the other heat pipe. The heat transfer between the heat source and the heat sink is essentially that of a heat pipe except for the very short heat conductive path through the solid block and the one rotating joint.

REFERENCES:
patent: 3831664 (1974-08-01), Pogson
patent: 4069864 (1978-01-01), Novoryta et al.
patent: 4345642 (1982-08-01), Ernst
patent: 5117901 (1992-06-01), Cullimore
patent: 5343940 (1994-09-01), Jean
patent: 5383340 (1995-01-01), Larson et al.
patent: 5413167 (1995-05-01), Hara et al.
patent: 5598320 (1997-01-01), Toedtman et al.
patent: 5621613 (1997-04-01), Haley et al.
patent: 5646822 (1997-07-01), Bhatia et al.

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