Heat pipe with improved wick structures

Details Heat pipe with improved wick structures Heat pipe with improved wick structures

1997-12-10

2000-05-02

Atkinson, Christopher

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

165911, F28D 1500

Patent

active

060560444

ABSTRACT:
An improved planar heat pipe wick structure having projections formed by micromachining processes. The projections form arrays of interlocking, semi-closed structures with multiple flow paths on the substrate. The projections also include overhanging caps at their tops to increase the capillary pumping action of the wick structure. The capped projections can be formed in stacked layers. Another layer of smaller, more closely spaced projections without caps can also be formed on the substrate in between the capped projections. Inexpensive materials such as Kovar can be used as substrates, and the projections can be formed by electrodepositing nickel through photoresist masks.

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