Heat pipe type radiation for electronic apparatus

Details Heat pipe type radiation for electronic apparatus Heat pipe type radiation for electronic apparatus

1993-03-22

1995-04-25

Chambers, A. Michael

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

16510426, 361700, F28D 1500

Patent

active

054090555

ABSTRACT:
A heat pipe type radiator is formed with a cooling plate mounted on an evaporative section of a heat pipe and a flat heat conductive plate mounted on a condenser section. Heat-generating electronic components are brought into contact with the cooling plate and a radiation fin molded from a thin plate in a wave form is mounted on both surfaces of the heat conductive plate. Other embodiments of the radiation fin include a skived fin formed by skiving a flat plate in an arch form, a pin fin and a wire fin which are composed of and so forth. Since each of these fins has the large surface area for heat radiation per unit volume and is small in weight, it is suitable to use for a heat pipe type radiator for an electronic apparatus. The heat generated in the electronic components transported to the heat conductive plate through the cooling plate and the heat pipe is radiated from the entire surface of the radiation fin to the ambient air. The heat conductive plate is molded in a flat form and, therefore, the heat generated in the electronic components can conduct to the portion most remote from the heat pipe. Further, since the radiation fin has a large surface area for heat radiation per unit volume, the heat radiation capability is improved.

REFERENCES:
patent: 3476175 (1969-11-01), Pleuyak
patent: 4118756 (1978-10-01), Nelson et al.
patent: 4685512 (1987-08-01), Edelstein et al.
patent: 4941530 (1990-07-01), Crowe
patent: 5199165 (1993-04-01), Crawford et al.
"Furukawa Heat Pipe FRHP" Furukawa Electric America, Inc. Peachtree City, Ga., 1992.
Japanese Document, ISBN-4-526-01913-5, pp. 113-116, 1992.

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