Heat pipe type cooling apparatus for semiconductor

Details Heat pipe type cooling apparatus for semiconductor Heat pipe type cooling apparatus for semiconductor

1988-12-14

1991-01-01

Hille, Rolf

Heat exchange

With valve or movable deflector for heat exchange fluid flow

With by-pass of heat exchanger or heat exchanger section

357 81, 16510433, H01L 2504

Patent

active

049822748

ABSTRACT:
A heat pipe type cooling apparatus for a semiconductor, comprises a plurality of first copper pipes, each of the first pipes having a plurality of V-shaped grooves formed in an inner surface thereof and arranged in a circumferential direction thereof, and a plurality of second copper pipes, each of the second pipes having a plurality of second grooves formed in an inner surface thereof, each of the second grooves having an opening narrower than an inner part thereof. A plurality of ceramic pipes connect the first pipes and the second pipes, through intermediate pipes made of a nickel-iron alloy. One end of each of the second pipes is inserted in a metal block on which a semiconductor is mounted.

REFERENCES:
patent: 3437132 (1969-04-01), Venema
patent: 4675783 (1987-06-01), Murase et al.

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