Heat pipe thermal mounting plate for cooling electronic circuit

Details Heat pipe thermal mounting plate for cooling electronic circuit Heat pipe thermal mounting plate for cooling electronic circuit

1977-04-14

1978-10-03

Davis, Jr., Albert W.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

165105, 357 82, 361388, H01L 2346

Patent

active

041187563

ABSTRACT:
Heat pipe technology may be utilized to cool circuit card-mounted electronic components. A heat pipe thermal mounting pipe has a very high thermal conductivity and provides a relatively uniform temperature surface for attaching of circuit card-mounted electronic components. It comprises thin evaporator and condenser wicks (for low temperature gradients) as well as a relatively porous sintered metal artery wick (for high heat transfer capability). The heat sink or other heat exchanger may be mounted at the edge of the thermal mounting plate in the vicinity of the condenser wick. The electronic components are mounted in the vicinity of the evaporator wicks.

REFERENCES:
patent: 3651865 (1972-03-01), Feldmanis
patent: 3680189 (1972-08-01), Noren
patent: 3822743 (1974-07-01), Waters
patent: 3901311 (1975-08-01), Kosson et al.

Affiliated with

Also associated with

Rating

Heat pipe thermal mounting plate for cooling electronic circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat pipe thermal mounting plate for cooling electronic circuit , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat pipe thermal mounting plate for cooling electronic circuit will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1805165